One of the keys to the design of high-speed power supply PCB boards for the PCB power layer wiring is to minimize the voltage drop caused by the line impedance and the various noises introduced by the conversion of high-frequency electromagnetic fields. Usually two methods are used to solve the above problems. One is the power bus technology (POWER BUS), and the other is the use of a separate power layer for power supply.

1. The AC input and DC output must be clearly separated. The best way is to be able to isolate each other.

2. The wiring distance between the input terminal and the output terminal (including the primary and secondary DC/DC conversion) should be at least 5 mm.

3. The control circuit and the main power circuit must have a clear layout distinction.

4. Try to avoid the parallel wiring of high current and high voltage wiring and measurement lines and control lines.

5. Put copper on the blank surface as much as possible.

6. In the wiring connection of high current and high voltage, try to avoid using wires to connect for long distances in space. The interference it causes is difficult to deal with.

7. If the cost permits, multi-layer board wiring can be used, with special auxiliary power layer and ground layer, which will greatly reduce the impact of EMC.

8. The working place is the most susceptible to interference, so try to use a large area copper wiring method.

9. The wiring of the shielded ground cannot form an obvious loop. In this way, an antenna effect will be formed and interference will be easily introduced.

10. High-power devices are best arranged in a relatively regular layout, which is convenient for the installation of the radiator and the design of the cooling air duct.

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