HDI is the abbreviation of High Density Interconnector in English, that is, high-density interconnection board. It is a circuit board with a relatively high  density of line distribution using micro-blind and buried via technology. Its advantages as below:

1. Increase circuit density, interconnection of traditional circuit boards and components.

2. It can reduce the cost of PCB. When the density of PCB increased to more than 8 layers, it is manufactured as HDI Board, and its cost will be lower than that of the traditional and complex pressing process.

3. Having better electrical performance and signal accuracy

4. Conducive to the use of advanced construction technology

5. It can improve the thermal properties

6. High insulation reliability and micro-via reliability;

7. It can improve radio frequency interference/electromagnetic wave interference/electrostatic discharge (RFI/EMI/ESD)

8. Increase design efficiency

HDI (High Density Interconnector) multi-layer boards are not only far superior to ordinary PCB circuit boards in terms of material selection and technology, but the performance is also far conducive to the needs of today's people, with interconnected densities, high frequency, and thin area.