High-density multi-layer circuit board manufacturers: products cover 1-32 layers, multi-layer boards, heavy copper boards, glass fiber boards, high-frequency microwaves and other special PCB boards.

The editor will explain to you the four major processes of high-density multilayer circuit boards: 

1. Immersion gold process

The nickel-gold coating with stable color, good brightness, smooth coating and good solderability deposited on the surface of the printed circuit can be basically divided into four stages: first: degreasing, micro-etching, activation, post-dipping, nickel-immersion, Immersion Gold, then: Scrap gold is not washed, DI washed, and dried.

2. Gold plating process

The vertical tin spraying process for proofing is difficult to flatten the thin pads, and the subsequent SMT work will also be difficult. In addition, the service life of the tin spraying board is generally short, and the gold-plated board just solves these problems.

3. Tin spraying process

Multi-layer board processing, tin spraying is also called "hot air leveling". Its function is to prevent oxidation of bare copper surface and maintain solderability. As a common surface coating form, the quality of tin spraying directly affects the quality of welding in subsequent production.

4. OSP Antioxidant

The control board proofing OSP has anti-oxidation, thermal shock and moisture resistance to protect the copper surface from rusting in the normal environment, but in the subsequent high temperature welding, this protective film must be easily removed by the flux Clearance, so that the exposed clean copper surface can be combined with the molten solder in a very short time to form a solid solder joint of the balance weight.