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Material: FR4 Number of layers: 6 layers Process: Immersion Gold Minimum drilling: 0.3mm Minimum line width: 1.0mm Minimum line space: 1.0mm Features: hole copper 25um, thick copper plate, 4OZ inside and outside, blind buried hole, coil plate
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| Six-layer coil PCB2 | |||
| Substrate: | FR4 | Layers: | 6 layers |
| Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
| Thickness of outer copper foil: | 4oz | Inner copper foil thickness: | 4oz |
| Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.3mm |
| Minimum line width: | 1.0mm | Minimum line space: | 1.0mm |
| Application area: | frequency converter | Features: | hole copper 25um, thick copper plate, 4OZ inside and outside, blind buried via, coil plate |








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