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Material: FR4-S1000H Number of layers: 2 layers Process: Lead-free tin spraying (tin, silver and copper) Minimum drilling: 0.3mm Minimum line width: 0.127mm Minimum line space: 0.127mm Features: IPC three-level standard, tin-silver-copper process
+86 0755-81772911
| Tin Silver Copper PCB | |||
| Substrate: | FR4 | Layers: | 2 layers |
| Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
| Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | / |
| Surface treatment method: | Lead-free tin spray (tin, silver and copper) | Minimum hole diameter: | 0.3mm |
| Minimum line width: | 0.127mm | Minimum line space: | 0.127mm |
| Application field | Industrial control industry | Features: | IPC level 3 standard, tin-silver-copper process |
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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.
QQ:343609301 E-mail:AnitaPCBA@pcb-hl.com
Add：Shayi North Yongfa Science and Technology Park, Xinhe Road, Shajing Street, Baoan District, Shenzhen
Main business: circuit board proofing circuit board proofing pcb proofing pcb circuit board multi-layer circuit board
