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Material: FR4-S1000-2 Number of layers: 10 layers Process: Immersion Gold Minimum drilling: 0.25mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: high-level PCB, impedance board, via plug holes are not allowed to redden
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10-layer motherboard PCB | |||
Substrate: | FR4 | Layers: | 10 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | 1oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.25mm |
Minimum line width: | 0.1mm | Minimum line space: | 0.1mm |
Application field | Industrial control motherboard | Features: | High-level PCB, impedance board, via plug holes are not allowed to redden |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.