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Material: FR4 Number of layers: 12 layers Process: Immersion Gold Minimum drilling: 0.5mm Outer copper foil: 6OZ Inner copper foil: 3OZ Board thickness: 4.0mm
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| Rogers Circuit Board | |||
| Substrate: | RO4350B | Layers: | 2 layers |
| Dielectric constant: | 3.48 | Board thickness: | 1.6mm |
| Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | / |
| Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.3mm |
| Minimum line width: | 0.3mm | Minimum line space: | 0.3mm |
| Application field | Communication industry | Features: | Rogers High Frequency Sheet |
![399c3ce2e3574f76815b951c89288a24_73[1].jpg 399c3ce2e3574f76815b951c89288a24_73[1].jpg](/upload/default/20210201/bebe27af31a9e093bf313cce29fbef1b.jpg)
![399c3ce2e3574f76815b951c89288a24_71[1].jpg 399c3ce2e3574f76815b951c89288a24_71[1].jpg](/upload/default/20210201/9f0bdbff2474f073c9f4123e0168dd7c.jpg)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


