Electric thick gold pcb

Substrate: FR4-S1000-2 Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 3oz Surface treatment method: electric gold Minimum hole diameter: 0.3mm

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Electric thick gold pcb
Substrate:	FR4-S1000-2	Layers:	2 layers
Dielectric constant:	4.2	Board thickness:	1.6mm
Thickness of outer copper foil:	3oz	hickness of inner copper foil:	/
Surface treatment method:	Electric gold	Minimum hole diameter:	0.5mm
Minimum line width:	1.6mm	Minimum line space:	0.9mm
Application areas:	conductive slip ring	Features:	Electric thick gold 30U"; finished copper foil thickness 3OZ
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand!

Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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