Halogen-free thick gold half-hole circuit board

Substrate: FR4 Hongren Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 0.8mm Outer copper foil thickness: 1oz Surface treatment method: Immersion gold 3U" Minimum hole diameter: 0.3mm

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Halogen-free thick gold half-hole circuit board
Substrate:	FR4 Hongren	Layers:	2 layers
Dielectric constant:	4.2	Board thickness:	0.8mm
Thickness of outer copper foil:	1oz	hickness of inner copper foil:	1oz
Surface treatment method:	Immersion gold	Minimum hole diameter:	0.3mm
Minimum line width:	0.127mm	Minimum line space:	0.127mm
Gold thickness:	3U"	Features:	All materials are halogen-free, immersion gold ≥3U", strict appearance requirements
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand!

Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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