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Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner layer copper foil thickness: 1oz Surface treatment: Immersion gold Minimum hole diameter: 0.15mm Minimum line width: 0.1MM Minimum line space: 0.1MM
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| Countersink circuit board | |||
| Substrate: | FR4 Shengyi | Dielectric constant: | 4.2 |
| Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
| Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.15mm |
| Minimum line width: | 0.1mm | Minimum line space: |
0.1mm |
| Gold thickness: | 1U" | Special requirements: | blind hole,The smallest hole is 0.15mm, a countersunk hole is required |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
![420a9a00020d48d8a9312cc5433342aa_67[1].jpg 420a9a00020d48d8a9312cc5433342aa_67[1].jpg](/upload/default/20210202/8aeb06ecb5fb36357d003130f0a6262d.jpg)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


