Immersion gold circuit board

Substrate: FR4 KB Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 1oz Surface treatment: Immersion gold Minimum hole diameter: 0.3mm

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Immersion gold circuit board
Substrate:	FR4 KB	Layers:	2 layers
Dielectric constant:	4.2	Board thickness:	1.6mm
Thickness of outer copper foil:	1oz	Inner copper foil thickness:	1oz
Surface treatment method:	Immersion gold	Minimum hole diameter:	0.3mm
Minimum line width:	0.3mm	Minimum line space:	0.3mm
Gold thickness:	1U"	Features:	Over 80% of the gold deposit area

Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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