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Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 0.5oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm Minimum line width: 0.01MM Minimum line space: 0.08MM
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| Buried Hole HDI Automotive Circuit Board | |||
| Substrate: | FR4 Lianmao | Dielectric constant: | 4.2 |
| Thickness of outer copper foil: | 1oz | Inner layer copper foil thickness: | 0.5oz |
| Surface treatment method: | thick copper | Minimum hole diameter: | 0.2mm |
| Minimum line width: | 0.01mm | Minimum line space: |
0.08mm |
| Gold thickness: | 1U" | Impedance requirements: | L1, L3, L5, 100 ohms |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
![b88a7de223404e8c8d08d61e9aeae6af_27[1].jpg b88a7de223404e8c8d08d61e9aeae6af_27[1].jpg](/upload/default/20210202/39d361327c6938d714fd8300acfa7ca2.jpg)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


