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Material: FR4- halogen free Number of layers: 4 layers Process: OSP Minimum drilling: 0.3mm Minimum line width: 0.127mm Minimum line space: 0.127mm Features: The whole process requires halogen-free, impedance board
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Halogen-free PCB | |||
Substrate: | FR4 | Layers: | 4 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.0mm |
Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
Surface treatment method: | OSP | Minimum hole diameter: | 0.3mm |
Minimum line width: | 0.127mm | Minimum line space: | 0.127mm |
Application area: | laptop touch position | Features: | The whole process requires halogen-free, impedance board |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.