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Material: FR4 Number of layers: 12 layers Process: Immersion Gold Minimum drilling: 0.5mm Outer copper foil: 6OZ Inner copper foil: 3OZ Board thickness: 4.0mm
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Thick copper PCB | |||
Substrate: | FR4-S1141 | Layers: | 12 layers |
Dielectric constant: | 4.3 | Board thickness: | 4.0mm |
Thickness of outer copper foil: | 6oz | Inner copper foil thickness: | 3oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.5mm |
Minimum line width: | 1.0mm | Minimum line space: | 1.0mm |
Application area: | Automotive power supply | Features: | 12-layer ultra-thick copper plate, high current, matt green ink |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.