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Thick copper PCB

Material: FR4 Number of layers: 12 layers Process: Immersion Gold Minimum drilling: 0.5mm Outer copper foil: 6OZ Inner copper foil: 3OZ Board thickness: 4.0mm

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+86 0755-81772911

Thick copper PCB
Substrate:  FR4-S1141 Layers:   12 layers
Dielectric constant:  4.3 Board thickness:  4.0mm
Thickness of outer copper foil:  6oz Inner copper foil thickness: 3oz
Surface treatment method:  Immersion gold Minimum hole diameter:  0.5mm
Minimum line width:  1.0mm Minimum line space:  1.0mm
Application area:  Automotive power supply Features:  12-layer ultra-thick copper plate, high current, matt green ink


Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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