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Material: FR4- halogen free Number of layers: 4 layers Process: Immersion gold & resin plug hole Minimum drilling: 0.25mm Minimum line width: 0.08mm Minimum line space: 0.08mm Features: BGA clamping wire 3mil, half hole board, resin plug hole, halogen-free, hole copper 25um impedance board
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5G module circuit board | |||
Substrate: | FR4-halogen free | Layers: | 4 layers |
Dielectric constant: | 4.3 | Board thickness: | 0.8mm |
Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.25mm |
Minimum line width: | 0.08mm | Minimum line space: | 0.08mm |
Application area: | 5G communication | Features: | BGA clamp wire 3mil, half hole board, resin plug hole, halogen-free, hole copper 25um impedance board |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.