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5G module circuit board

Material: FR4- halogen free Number of layers: 4 layers Process: Immersion gold & resin plug hole Minimum drilling: 0.25mm Minimum line width: 0.08mm Minimum line space: 0.08mm Features: BGA clamping wire 3mil, half hole board, resin plug hole, halogen-free, hole copper 25um impedance board

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+86 0755-81772911

5G module circuit board
Substrate:  FR4-halogen free Layers:  4 layers
Dielectric constant:  4.3 Board thickness:  0.8mm
Thickness of outer copper foil:  1oz Inner copper foil thickness: 1oz
Surface treatment method:  Immersion gold Minimum hole diameter:  0.25mm
Minimum line width:  0.08mm Minimum line space:  0.08mm
Application area:  5G communication Features:  BGA clamp wire 3mil, half hole board, resin plug hole, halogen-free, hole copper 25um impedance board


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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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