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Substrate: FR4 KB Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 1oz Surface treatment method: lead-free spray tin Minimum hole diameter: 0.3mm
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Gold finger pcb | |||
Substrate: | FR4 | Layers: | 6 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.2mm |
Minimum line width: | 0.1mm | Minimum line space: | 0.1mm |
Application area: | Medical | Features: | Impedance board, gold finger electric thick gold, precise line width and line spacing |
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.