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Four-layer spray tin circuit board

Substrate: FR4 KB Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 1oz Surface treatment method: lead-free spray tin Minimum hole diameter: 0.3mm

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Gold finger pcb
Substrate:  FR4 Layers:   6 layers
Dielectric constant:  4.3 Board thickness:  1.6mm
Thickness of outer copper foil:  1oz Inner copper foil thickness: 1oz
Surface treatment method:  Immersion gold Minimum hole diameter:  0.2mm
Minimum line width:  0.1mm Minimum line space:  0.1mm
Application area:  Medical Features:  Impedance board, gold finger electric thick gold, precise line width and line spacing
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand!


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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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