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Substrate: FR4 KB Number of layers: 4 layers Dielectric constant: 4.2 Board thickness: 0.8MM+/-0.05mm Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm
+86 0755-81772911
| Type-c circuit board | |||
| Substrate: | FR4 KB | Layers: | 4 layers |
| Dielectric constant: | 4.2 | Board thickness: | 0.8mm |
| Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
| Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.2mm |
| Minimum line width: | 0.127mm | Minimum line space: | 0.127mm |
| Gold thickness: | 1U" | Features: | Mobile phone plug board, board thickness and size tolerance +/-0.05mm |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
![fde2fbe115694412a3a15e3c28541924_8[1].png](/upload/default/20210202/c67d4599de567a8b9e775c2c80427ee9.png "fde2fbe115694412a3a15e3c28541924_8[1].png")
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.
QQ:343609301 E-mail:AnitaPCBA@pcb-hl.com
Add：Shayi North Yongfa Science and Technology Park, Xinhe Road, Shajing Street, Baoan District, Shenzhen
Main business: circuit board proofing circuit board proofing pcb proofing pcb circuit board multi-layer circuit board
