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Power PCB

Substrate: FR4 Hongren Shelf: 4 layers Dielectric constant: 4.2 Board thickness: 1.6MM Thickness of outer copper foil: 2oz Inner layer copper foil thickness: 2oz Surface treatment method: Immersion gold

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+86 0755-81772911

FR4 Automotive Immersion Gold PCB
Substrate:  FR4 Hongren Layers:  4 layers
Dielectric constant:  4.2 Special process:  thick copper thick gold plate
Board thickness:  1.6MM Thickness of outer copper foil:  2oz
Inner copper foil thickness:  2oz Surface treatment method:  Immersion gold
Minimum hole diameter:  0.3mm Minimum line width:  0.3mm
Minimum line space:  0.3MM Gold thickness:   3U"
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand!


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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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