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Substrate: FR4 Hongren Shelf: 4 layers Dielectric constant: 4.2 Board thickness: 1.6MM Thickness of outer copper foil: 2oz Inner layer copper foil thickness: 2oz Surface treatment method: Immersion gold
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FR4 Automotive Immersion Gold PCB | |||
Substrate: | FR4 Hongren | Layers: | 4 layers |
Dielectric constant: | 4.2 | Special process: | thick copper thick gold plate |
Board thickness: | 1.6MM | Thickness of outer copper foil: | 2oz |
Inner copper foil thickness: | 2oz | Surface treatment method: | Immersion gold |
Minimum hole diameter: | 0.3mm | Minimum line width: | 0.3mm |
Minimum line space: | 0.3MM | Gold thickness: | 3U" |
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.