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Sub-board PCB

Material: FR4 Number of layers: 2 layers Process: Immersion Gold Min drilling hole: 0.3mm Minimum line width: 0.2mm Minimum line space: 0.2mm Features: complex appearance, strict appearance requirements

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+86 0755-81772911

Sub-board PCB
Substrate:  FR4 Layers:  2 layers
Dielectric constant:  4.3 Board thickness:  1.0mm
Thickness of outer copper foil:  1oz hickness of inner copper foil:  /
Surface treatment method:  Immersion gold Minimum hole diameter:  0.3mm
Minimum line width:  0.2mm Minimum line space:  0.2mm
Application field: Consumer electronics sub-board Features:  complex appearance, strict appearance requirements



Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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