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Material: FR4 Number of layers: 2 layers Process: Immersion Gold Min drilling hole: 0.3mm Minimum line width: 0.2mm Minimum line space: 0.2mm Features: complex appearance, strict appearance requirements
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Sub-board PCB | |||
Substrate: | FR4 | Layers: | 2 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.0mm |
Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | / |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.3mm |
Minimum line width: | 0.2mm | Minimum line space: | 0.2mm |
Application field: | Consumer electronics sub-board | Features: | complex appearance, strict appearance requirements |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.