ShenZhen HL-PCB Circuit Co., Ltd.

制程能力及检测参数 Process capability and checking parameters
N0	ITEM	Technical capabilities
1	层次 Layers	2-32layers
2	最大尺寸 Max.Board Size	1200*625mm
		47"*25"
3	板厚 Finished Board Thickness	0.15mm-10.0mm
		0.006"--0.4"
4	铜厚 Finished Copper Thickness	17um-420um
		0.5OZ--12OZ
5	最小线宽/线距 Min.Trace Width/Space	0.075mm/0.065mm
		0.003"/0.0026"
6	最小孔径 Min.Hole Size	0.1mm
		0.004"
7	PTH孔孔径差 Hole Dim. Tolerance(PTH)	±0.05mm
		±0.002"
8	NPTH孔孔径差 Hole Dim.Tolerance(NPTH)	+0/-0.05mm
		+0/-0.002"
9	孔位公差 Drill Location Tolerance	±0.05mm
		±0.002"
10	V-CUT角度 V-Score Degrees	20-90°
		20DEG-90DEG
11	最小V-CUT板厚 Min.V-Score PCB Thickness	0.4mm
		0.016"
12	外型公差 CNC Routing Tolerance	±0.075mm
		±0.003"
13	最小盲/埋孔 Min.Blind/Buried Via	0.1mm
		0.04”
14	塞孔 Plug Hole Size	0.2mm--0.6mm
		0.008"--0.024"
15	最小BGA Min.BGA PAD	0.18mm
		0.007"
16	材质 Materials	FR4,铝基，高Tg,无卤，罗杰斯，铁氟龙，ISOLA
		FR4,Aluminium,HighTg,Halogen-free，Rogers，Teflon，ISOLA
17	表面处理 Surface Finish	无铅喷锡，沉金，沉银，沉锡，OSP，电厚金，沉金+OSP，喷锡+金手指，镍钯金
		LF-HAL,ENIG,ImAg,ImSn,OSP,Gold plating,ENIG+OSP,HAL+G/F,ENEPIG
18	翘曲度 Warp&Twist	≤0.5%

19	通断测试 Electrical Testing	50--300V

20	可焊性试验 Solderability Testing	245±5℃,3sec Wetting area least95%
21	热冲击试验 Thermal Cycling Testing	288±5℃,10sec,3cycles
22	离子污染测试 Ionic Contamination Testing	Pb,Hg,Cd,Cr(VI),PBB,PBDE六项均小等于1000ppm
		Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23	附着力测试 Soldmask Adhesion Testing	260℃+/-5,10S，3times

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