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Material: FR4 Number of layers: 2 layers Process: Immersion Gold 3U" Minimum drilling: 0.3mm Minimum line width: 0.3mm Minimum line space: 0.3mm Features: 3.2mm thick plate, need bevel edge, countersunk hole process
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Special circuit board | |||
Substrate: | FR4 | Layers: | 2 layers |
Dielectric constant: | 4.3 | Board thickness: | 3.2mm |
Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | / |
Surface treatment method: | Immersion gold 3U" | Minimum hole diameter: | 0.3mm |
Minimum line width: | 0.3mm | Minimum line space: | 0.3mm |
Application areas: | Industrial control industry | Features: | 3.2mm thick plate, need beveled edge, with countersunk hole process |
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.