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​Material: FR4 Number of layers: 4 layers Process: OSP Minimum drilling: 0.4mm Minimum line width: 0.2mm Minimum line space: 0.2mm Features: black characters 【MORE】
Material: FR4-S1000H Number of layers: 2 layers Process: Lead-free tin spraying (tin, silver and copper) Minimum drilling: 0.3mm Minimum line width: 0.127mm Minimum line space: 0.127mm Features: IPC three-level standard, tin-silver-copper process 【MORE】
Material: FR4-S1000-2M Number of layers: 10 layers Process: Immersion Gold Minimum drilling hole: 0.25mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: high-level impedance board, line width and line spacing 4mil 【MORE】
Material: FR4-S1000-2M Number of layers: 12 layers Process: Immersion Gold Minimum drilling: 0.25mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: high-level impedance board, line width and line spacing 4mil 【MORE】
Material: FR4-S1000-2 Number of layers: 10 layers Process: Immersion Gold Minimum drilling: 0.25mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: high-level PCB, impedance board, via plug holes are not allowed to redden 【MORE】
Material: FR4 Number of layers: 4 layers Process: OSP Minimum drilling: 0.4mm Minimum line width: 0.2mm Minimum line spacing: 0.2mm Features: black characters 【MORE】
Material: FR4 Number of layers: 6 layers Process: Immersion Gold Min drilling hole: 0.3mm Minimum line width: 0.127mm Minimum line space: 0.127mm Features: hole copper 25um, appearance IPC three-level standard, do not accept oil supply line 【MORE】
Material: FR4 Number of layers: 6 layers Process: Immersion Gold Min drilling hole: 0.3mm Minimum line width: 1.0mm Minimum line space: 1.0mm Features: hole copper 25um, thick copper plate, 4OZ inside and outside, blind buried hole, coil plate 【MORE】
Material: FR4 Number of layers: 6 layers Process: Immersion Gold Min drilling hole: 0.3mm Minimum line width: 1.0mm Minimum line space: 1.0mm Features: hole copper 25um, thick copper plate, 4OZ inside and outside, blind buried hole, coil plate 【MORE】