Communication circuit board

Material: Teflon Number of layers: 2 layers Process: Shen tin Minimum drilling: 0.3mm Minimum line width: 0.5mm Minimum line space: 0.5mm Features: high frequency sheet, low dielectric constant

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Communication circuit board
Substrate:	Teflon	Layers:	2 layers
Dielectric constant:	2.65	Board thickness:	1.0mm
Thickness of outer copper foil:	1.5oz	hickness of inner copper foil:	/
Surface treatment method:	Shen tin	Minimum hole diameter:	0.3mm
Minimum line width:	0.5mm	Minimum line space:	0.5mm
Application areas:	Communication satellite base station	Features:	high frequency sheet, low dielectric constant
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand!

Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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