Thick copper 4OZ circuit board

Substrate: FR4 Shengyi TG170 Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 4oz Surface treatment method: Immersion gold Minimum hole diameter: 0.5mm

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Thick copper 4OZ circuit board
Substrate:	FR4 Shengyi TG170	Layers:	2 layers
Dielectric constant:	4.2	Board thickness:	1.6mm
Thickness of outer copper foil:	4oz	hickness of inner copper foil:	/
Surface treatment method:	Immersion gold	Minimum hole diameter:	0.5mm
Minimum line width:	0.5mm	Minimum line space:	0.5mm
Application areas:	Industrial power supply industry	Features:	Finished copper foil thickness 4OZ
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand!

Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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