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Substrate: FR4 KB Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.3mm Minimum line width and distance: 0.2MM
+86 0755-81772911
| Special circuit board | |||
| Substrate: | FR4 KB | Layers: | 2 layers |
| Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
| Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
| Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.3mm |
| Minimum line width: | 0.3mm | Minimum line space: | 0.3mm |
| Gold thickness: | 1U" | Features: | Over 80% of the gold deposit area |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
![fde2fbe115694412a3a15e3c28541924_30[1].png](/upload/art/20210204/cab32830a60269bb060cccb4ed475687.png "fde2fbe115694412a3a15e3c28541924_30[1].png")
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.
QQ:343609301 E-mail:AnitaPCBA@pcb-hl.com
Add：Shayi North Yongfa Science and Technology Park, Xinhe Road, Shajing Street, Baoan District, Shenzhen
Main business: circuit board proofing circuit board proofing pcb proofing pcb circuit board multi-layer circuit board
