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Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner layer copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm Minimum line width: 0.28MM Minimum line space: 0.12MM
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| Blind gong craft circuit board | |||
| Substrate: | FR4 KB | Dielectric constant: | 4.2 |
| Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
| Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.3mm |
| Minimum line width: | 0.28mm | Minimum line space: | 0.12mm |
| Gold thickness: | 2U" | Impedance requirements: | none |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
![46b27b3ba7784b34b0cad47982abed4b_8[1].png 46b27b3ba7784b34b0cad47982abed4b_8[1].png](/upload/default/20210204/d3d9ac5dba8b8576606ff4c7b89be823.png)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


