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High-level impedance board

Material: FR4-S1000-2M Number of layers: 10 layers Process: Immersion Gold Minimum drilling hole: 0.25mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: high-level impedance board, line width and line spacing 4mil

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+86 0755-81772911

High-level impedance board
Substrate:  FR4 Layers:  10 layers
Dielectric constant:  4.3 Board thickness:  1.6mm
Thickness of outer copper foil:  1oz hickness of inner copper foil:  1oz
Surface treatment method:  Immersion gold Minimum hole diameter:  0.25mm
Minimum line width:  0.1mm Minimum line space:  0.1mm
Application field Communication industry Features:  High-level impedance board, line width and line spacing 4mil


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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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