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Gold Finger PCB

Material: FR4 Number of layers: 4 layers Process: Immersion Gold Minimum Drilling: 0.2mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: gold finger, impedance board, gold finger needs bevel

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+86 0755-81772911

Gold Finger PCB
Substrate:  FR4 Layers:  4 layers
Dielectric constant:  4.3 Board thickness:  1.6mm
Thickness of outer copper foil:  1oz hickness of inner copper foil:  1oz
Surface treatment method:  Immersion gold Minimum hole diameter:  0.2mm
Minimum line width:  0.1mm Minimum line space:  0.1mm
Application field  Communication industry Features:  gold finger, impedance board, gold finger needs bevel


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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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