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Material: FR4 Number of layers: Four layers Process: Immersion gold Minimum drilling: 0.25mm Minimum line width: 0.127mm Minimum line space: 0.127mm Features: Four-layer impedance board, non-inductive scratching is not accepted, strict appearance requirements
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Multilayer Immersion Gold Circuit Board | |||
Substrate: | FR4 | Layers: | 4 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | 1oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.25mm |
Minimum line width: | 0.127mm | Minimum line space: | 0.127mm |
Application field | Industrial control | Features: | Four-layer impedance board, non-inductive scratching is not accepted, and strict appearance requirements |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.