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Multilayer Immersion Gold Circuit Board

Material: FR4 Number of layers: Four layers Process: Immersion gold Minimum drilling: 0.25mm Minimum line width: 0.127mm Minimum line space: 0.127mm Features: Four-layer impedance board, non-inductive scratching is not accepted, strict appearance requirements

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+86 0755-81772911

Multilayer Immersion Gold Circuit Board
Substrate:  FR4 Layers:  4 layers
Dielectric constant:  4.3 Board thickness:  1.6mm
Thickness of outer copper foil:  1oz hickness of inner copper foil:  1oz
Surface treatment method:  Immersion gold Minimum hole diameter:  0.25mm
Minimum line width:   0.127mm Minimum line space:   0.127mm
Application field Industrial control Features:  Four-layer impedance board, non-inductive scratching is not accepted, and strict appearance requirements


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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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