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Material: FR4 Number of layers: four layers Process: Immersion Gold Minimum drilling: 0.2mm Minimum line width: 0.1mm Minimum line spacing: 0.1mm Features: Four-layer impedance board, gold finger, card slot tolerance +/-0.05mm, no inductive scratching is not accepted
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Four-layer gold finger circuit board | |||
Substrate: | FR4 | Layers: | 4 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | 1oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.2mm |
Minimum line width: | 0.1mm | Minimum line space: | 0.1mm |
Application field | Industrial control | Features: | Four-layer impedance board, gold finger, card slot tolerance +/-0.05mm, non-inductive scratching is not accepted |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.