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Material: FR4-TG170 Number of layers: 8 layers Process: Immersion Gold Minimum Drilling: 0.2mm Minimum line width: 0.08mm Minimum line space: 0.08mm Features: resin plug hole, 3mil BGA clamping line, impedance board, gold finger board
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High precision impedance PCB | |||
Substrate: | FR4 | Layers: | 8 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.0mm |
Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | 1oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.2mm |
Minimum line width: | 0.8mm | Minimum line space: | 0.8mm |
Application field | financial equipment | Features: | Resin plug hole, BGA clamping line 3mil, impedance board, gold finger board |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.