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Substrate: FR4 Shengyi Number of layers: 6 layers Dielectric constant: 4.2 Board thickness: 1.0mm Thickness of inner and outer copper foil: 1oz Surface treatment method: Immersion gold 3U" Minimum hole diameter: 0.2mm
+86 0755-81772911
| Half hole module board | |||
| Substrate: | FR4 Shengyi | Layers: |
6 layers |
| Dielectric constant: | 4.2 | Board thickness: | 1.0mm |
| Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | 1oz |
| Surface treatment method: | Immersion gold 3U" | Minimum hole diameter: | 0.3mm |
| Minimum line width: | 0.08mm | Minimum line space: |
0.08mm |
| Gold thickness: | 3U" | Features: | Half hole board, line width and line spacing 3.5/3.5mil, inner hole spacing 0.152mm |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.
QQ:343609301 E-mail:AnitaPCBA@pcb-hl.com
Add：Shayi North Yongfa Science and Technology Park, Xinhe Road, Shajing Street, Baoan District, Shenzhen
Main business: circuit board proofing circuit board proofing pcb proofing pcb circuit board multi-layer circuit board
