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Material: FR4 Number of layers: 4 layers Process: Immersion Gold Minimum drilling: 0.2mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: gold finger, impedance board, gold finger needs bevel
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Gold Finger PCB | |||
Substrate: | FR4 | Layers: | 4 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.2mm |
Minimum line width: | 0.1mm | Minimum line space: | 0.1mm |
Application area: | communication | Features: | gold finger, impedance board, gold finger needs bevel |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.