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Material: FR4-Shengyi Board thickness: 1.6mm Number of layers: 6 layers Process: Immersion Gold Minimum drilling: 0.3mm Minimum line width: 0.127mm Minimum line space: 0.127mm
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5G circuit board | |||
Substrate: | FR4 | Layers: | 6 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.3mm |
Minimum line width: | 0.127mm | Minimum line space: | 0.127mm |
Application area: | 5G communication | Features: | Large gold surface, double-sided windows for plug holes, no light transmission, no scratching |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.