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5G circuit board

Material: FR4-Shengyi Board thickness: 1.6mm Number of layers: 6 layers Process: Immersion Gold Minimum drilling: 0.3mm Minimum line width: 0.127mm Minimum line space: 0.127mm

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+86 0755-81772911

5G circuit board
Substrate:  FR4 Layers:  6 layers
Dielectric constant:  4.3 Board thickness:  1.6mm
Thickness of outer copper foil:  1oz Inner copper foil thickness: 1oz
Surface treatment method:  Immersion gold Minimum hole diameter:  0.3mm
Minimum line width:  0.127mm Minimum line space:  0.127mm
Application area:  5G communication Features:  Large gold surface, double-sided windows for plug holes, no light transmission, no scratching



Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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