

Hotline
Material: FR4 Number of layers: 12 layers Process: Immersion Gold Minimum drilling: 0.5mm Outer copper foil: 6OZ Inner copper foil: 3OZ Board thickness: 4.0mm
+86 0755-81772911
| Thick copper PCB | |||
| Substrate: | FR4-S1141 | Layers: | 12 layers |
| Dielectric constant: | 4.3 | Board thickness: | 4.0mm |
| Thickness of outer copper foil: | 6oz | Inner copper foil thickness: | 3oz |
| Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.5mm |
| Minimum line width: | 1.0mm | Minimum line space: | 1.0mm |
| Application area: | Automotive power supply | Features: | 12-layer ultra-thick copper plate, high current, matt green ink |
![399c3ce2e3574f76815b951c89288a24_71[1].jpg](/upload/default/20210201/9f0bdbff2474f073c9f4123e0168dd7c.jpg)
![399c3ce2e3574f76815b951c89288a24_73[1].jpg](/upload/default/20210201/bebe27af31a9e093bf313cce29fbef1b.jpg)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


