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Material: FR4 Number of layers: 4 layers Process: OSP Minimum drilling: 0.3mm Minimum line width: 0.127mm Minimum line space: 0.127mm Features: Strict appearance requirements
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| Xiaomi circuit board | |||
| Substrate: | FR4 | Layers: | 4 layers |
| Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
| Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
| Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.3mm |
| Minimum line width: | 0.127mm | Minimum line space: | 0.127mm |
| Application area: | Xiaomi mobile phone | Features: | Strict appearance requirements |
![026e609ad54544e899ae8c5d9d9da603_32[1].jpg 026e609ad54544e899ae8c5d9d9da603_32[1].jpg](/upload/default/20210201/ba9ab5a1d2807e8b52ad8a4f76e50767.jpg)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


