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Material: FR4 Number of layers: 4 layers Process: OSP Minimum drilling: 0.3mm Minimum line width: 0.127mm Minimum line space: 0.127mm Features: Strict appearance requirements
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Xiaomi circuit board | |||
Substrate: | FR4 | Layers: | 4 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.3mm |
Minimum line width: | 0.127mm | Minimum line space: | 0.127mm |
Application area: | Xiaomi mobile phone | Features: | Strict appearance requirements |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.