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Material: FR4 Number of layers: 6 layers Process: Immersion Gold + Half Hole Minimum drilling: 0.2mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: half hole impedance board, via plug hole
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Half Hole Module PCB | |||
Substrate: | FR4 | Layers: | 6 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.0mm |
Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.2mm |
Minimum line width: | 0.1mm | Minimum line space | 0.1mm |
Application area: | Module | Features: | Half-hole impedance board, via plug hole |
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.