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Half Hole Module PCB

Material: FR4 Number of layers: 6 layers Process: Immersion Gold + Half Hole Minimum drilling: 0.2mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: half hole impedance board, via plug hole

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+86 0755-81772911

Half Hole Module PCB
Substrate:  FR4 Layers:   6 layers
Dielectric constant:  4.3 Board thickness:  1.0mm
Thickness of outer copper foil:  1oz Inner copper foil thickness: 1oz
Surface treatment method:  Immersion gold Minimum hole diameter:  0.2mm
Minimum line width:  0.1mm Minimum line space  0.1mm
Application area:  Module Features:  Half-hole impedance board, via plug hole
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand!


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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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