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Material: FR4 Number of layers: 4 layers Process: Immersion Gold + Half Hole Minimum drilling: 0.3mm Minimum line width: 0.127mm Minimum line space: 0.1mm Features: Half-hole impedance board, via hole plug hole, silk-printed white oil block on the back should be flat
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| Bluetooth module half hole PCB | |||
| Substrate: | FR4 | Layers: | 4 layers |
| Dielectric constant: | 4.3 | Board thickness: | 0.8mm |
| Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
| Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.3mm |
| Minimum line width: | 0.127mm | Minimum line space: | 0.1mm |
| Application area: | Bluetooth module | Features: | Hole impedance board, via hole plug hole, silk-printed white oil block on the back should be flat |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
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![2946a4217494442ea7c5cdd2443e6b9b_18[1].jpg 2946a4217494442ea7c5cdd2443e6b9b_18[1].jpg](/upload/default/20210202/fd4e4671932c3440b6b77e3c22af3006.jpg)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


