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Material: FR4 Number of layers: 4 layers Process: Immersion Gold Minimum drilling: 0.2mm Minimum line width: 0.127mm Minimum line space: 0.127mm Features: impedance requirements, strict appearance requirements
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| UAV circuit board | |||
| Substrate: | FR4 | Layers: | 4 layers |
| Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
| Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
| Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.2mm |
| Minimum line width: | 0.127mm | Minimum line space: | 0.127mm |
| Application area: | UAV | Features: | Impedance requirements, strict appearance requirements |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
![412013c8eab84cb39e90d87e4d1af0f6_20[1].jpg 412013c8eab84cb39e90d87e4d1af0f6_20[1].jpg](/upload/default/20210202/bbe571d213208432b5883653ea74057d.jpg)
![412013c8eab84cb39e90d87e4d1af0f6_18[1].jpg 412013c8eab84cb39e90d87e4d1af0f6_18[1].jpg](/upload/default/20210202/33ab7377f6da313a82c52e37006cb069.jpg)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


