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Communication circuit board

Material: FR4-S1141 Number of layers: 4 layers Process: Immersion Gold Minimum drilling: 0.3mm Minimum line width: 0.2mm Minimum line space: 0.2mm Features: Need to control the impedance, the area of immersion gold is super-conventional, and the plate needs raw materials

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+86 0755-81772911

Communication circuit board
Substrate:  FR4-S1141 Layers:   4 layers
Dielectric constant:  4.3 Board thickness:  1.6mm
Thickness of outer copper foil:  1oz Inner copper foil thickness: 1oz
Surface treatment method:  Immersion gold Minimum hole diameter:  0.3mm
Minimum line width:  0.2mm Minimum line space:  0.2mm
Application area:  Communication industry Features:  Need to control the impedance, the area of immersion gold is super-conventional, and the plate needs raw materials
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand!


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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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