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Material: FR4-S1141 Number of layers: 4 layers Process: Immersion Gold Minimum drilling: 0.3mm Minimum line width: 0.2mm Minimum line space: 0.2mm Features: Need to control the impedance, the area of immersion gold is super-conventional, and the plate needs raw materials
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Communication circuit board | |||
Substrate: | FR4-S1141 | Layers: | 4 layers |
Dielectric constant: | 4.3 | Board thickness: | 1.6mm |
Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.3mm |
Minimum line width: | 0.2mm | Minimum line space: | 0.2mm |
Application area: | Communication industry | Features: | Need to control the impedance, the area of immersion gold is super-conventional, and the plate needs raw materials |
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.