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Material: FR4 Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm Minimum line width: 0.1MM
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| Security circuit board | |||
| Base material: | FR4 Shengyi S1000-2 | Dielectric constant: | 4.2 |
| Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
| Surface treatment method: | OSP | Minimum hole diameter: | 0.2mm |
| Minimum line width: | 0.1mm | Minimum line space: | 0.08mm |
| Special process: | Immersion gold | Impedance requirement: | L1, L3 50 ohm |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
![57693767101d474d8dba0a4b469daf4f_10[1].jpg 57693767101d474d8dba0a4b469daf4f_10[1].jpg](/upload/default/20210202/7b2f05f553ebf6b4c14e9f1d1a80bf88.jpg)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


