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Material: FR4 Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: OSP Minimum hole diameter: 0.2mm Minimum line width: 0.1MM Minimum line distance: 0.1MM
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| Security PCB | |||
| Base material: | FR4 KB | Dielectric constant: | 4.2 |
| Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
| Surface treatment method: | OSP | Minimum hole diameter: | 0.2mm |
| Minimum line width: | 0.1mm | Minimum line space: | 0.1mm |
| Surface treatment method: | OSP | Impedance requirement: | L1, L3 50 ohm |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
![12c411ca77c94bdcb42fb4502e9190ec_16[1].png 12c411ca77c94bdcb42fb4502e9190ec_16[1].png](/upload/default/20210202/81d82959ebeebd2688c792f844eed75f.png)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


