Buried Hole HDI Automotive Circuit Board

Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 0.5oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm Minimum line width: 0.01MM Minimum line distance: 0.08MM

Advisory

National Hotline

+86 0755-81772911

Buried Hole HDI Automotive Circuit Board
Substrate:	FR4 Lianmao	Dielectric constant:	4.2
Thickness of outer copper foil:	1oz	Inner copper foil thickness:	0.5oz
Surface treatment method:	thick copper	Minimum hole diameter:	0.2mm
Minimum line width:	0.1mm	Minimum line space:	0.08mm
Gold thickness:	1U"	Impedance requirement:	L1, L3, L5, 100 ohms
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand!

Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

Pre

Back