Gold finger circuit board

Substrate: FR4 Shengyi Dielectric constant: 4.2 Board thickness: 1.6MM Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: gold finger Minimum hole diameter: 0.2mm

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Gold finger circuit board
Substrate:	FR4 Shengyi	Dielectric constant:	4.2
Board thickness:	1.6MM	Thickness of outer copper foil:	1oz
Inner copper foil thickness:	1oz	Surface treatment method:	Immersion gold
Minimum hole diameter:	0.2mm	Minimum line width:	0.1mm
Minimum line space:	0.1mm	Special Industrial Zone:	Golden Finger
Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand!

Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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