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Substrate: FR4 Hongren Number of layers: 4 layers Dielectric constant: 4.2 Board thickness: 1.6MM Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold
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| Medical FR4 Lianmao multilayer circuit board | |||
| Substrate: | FR4 Hongren | Layers: | 4 layers |
| Dielectric constant: | 4.2 |
Board thickness: | 1.6mm |
| Thickness of outer copper foil: | 1oz | Inner copper foil thickness: | 1oz |
| Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.2mm |
| Minimum line width: | 0.1mm | Minimum line space: | 0.15mm |
| Gold thickness: | 2U" | Impedance requirement: | L1, L3 50 ohm |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
![420a9a00020d48d8a9312cc5433342aa_10[1].jpg 420a9a00020d48d8a9312cc5433342aa_10[1].jpg](/upload/default/20210203/cc74bdb7e48418b59e21caaf1adcdd9c.jpg)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


