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Substrate: FR4 KB Shelf: 4 layers Dielectric constant: 4.2 Board thickness: 3.2MM Thickness of outer copper foil: 1oz Thickness of inner copper foil: 1oz Surface treatment method: lead-free spray tin
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| Conventional FR4 board | |||
| Base material: | FR4-KB | Layers: | 4 layers |
| Dielectric constant: | 4.2 | Purpose: | Industrial Control |
| Board thickness: | 3.2mm | Thickness of outer copper foil: | 1oz |
| Inner copper foil thickness: | 1oz | Surface treatment method: | lead-free spray tin |
| Minimum hole diameter: | 0.3mm | Minimum line width: | 0.2mm |
| Minimum line space: | 0.2mm | Jin Hou: | / |
| Warm reminder: Due to the particularity of the product, customized products will not be returned, please understand! | |||
![420a9a00020d48d8a9312cc5433342aa_30[1].jpg 420a9a00020d48d8a9312cc5433342aa_30[1].jpg](/upload/default/20210202/01739bddc995d3b09fa98257c5a694d8.jpg)
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.


