Memory PCB

Material: FR4 Number of layers: 2 layers Process: Immersion Gold Minimum drilling: 0.25mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: hole copper 25um, gold fingers need beveled edges, and black oil bridges need to be retained

Advisory

National Hotline

+86 0755-81772911

Memory PCB
Substrate:	FR4	Layers:	2 layers
Dielectric constant:	4.3	Board thickness:	1.6mm
Thickness of outer copper foil:	1oz	hickness of inner copper foil:	/
Surface treatment method:	Immersion gold	Minimum hole diameter:	0.25mm
Minimum line width:	0.1mm	Minimum line space:	0.1mm
Application areas:	device memory	Features:	25um copper hole, gold fingers need beveled edges, and black oil bridges need to be retained

Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

Pre

Back