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Double-sided Immersion Gold Board

Material: FR4 Board thickness: 1.6mm Number of layers: 2 layers Process: Immersion Gold Min drilling hole: 0.3mm Minimum line width: 0.127mm Minimum line space: 0.127mm

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+86 0755-81772911

Memory PCB
Substrate:  FR4 Layers:  2 layers
Dielectric constant:  4.3 Board thickness:  1.6mm
Thickness of outer copper foil:  1oz hickness of inner copper foil:  /
Surface treatment method:  Immersion gold Minimum hole diameter:  0.25mm
Minimum line width:  0.1mm Minimum line space:  0.1mm
Application areas:  device memory Features:  25um copper hole, gold fingers need beveled edges, and black oil bridges need to be retained


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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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