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Material: FR4 Board thickness: 0.3mm Number of layers: 2 layers Process: Immersion Gold Minimum drilling: 0.3mm Minimum line width: 0.127mm Minimum line space: 0.127mm Features: ultra-thin board, single-sided V cut,
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Thin PCB | |||
Substrate: | FR4 | Layers: | 2 layers |
Dielectric constant: | 4.3 | Board thickness: | 0.3mm |
Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | / |
Surface treatment method: | Immersion gold | Minimum hole diameter: | 0.127mm |
Minimum line width: | 0.127mm | Minimum line space: | 0.127mm |
Application areas: | Valve | Features: | Ultra-thin board, single-sided V-cut, irregular shape |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.