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Material: FR4-S1000-2M Number of layers: 2 layers Process: Nickel Palladium Minimum drilling: 0.25mm Minimum line width: 0.127mm Minimum line spacing: 0.127mm Features: hole copper 25um, inspection under a microscope at 20 times does not allow the pad to be dirty
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Nickel Palladium Gold PCB | |||
Substrate: | FR4-S1000-2M | Layers: | 2 layers |
Dielectric constant: | 4.3 | Board thickness: | 0.8mm |
Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | / |
Surface treatment method: | nickel palladium gold | Minimum hole diameter: | 0.25mm |
Minimum line width: | 0.127mm | Minimum line space: | 0.127mm |
Application areas: | Semiconductor | Features: | Hole copper 25um, 100% inspection under a hundred times microscope does not allow the pad to be dirty |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.